High-vacuum Drying Oven
Vacuum Drying Oven for Semiconductor Electronics
Application Overview
The HMDS vacuum drying oven dries semiconductor wafers during HMDS pretreatment. Program settings automatically control evacuation, nitrogen admission, evacuation and subsequent steps to carry out HMDS pretreatment for the resist-coating process in photolithography. The high-vacuum drying oven can be used in clean environments to meet high-vacuum, dust-free production requirements. It is used in semiconductor wafer production workshops and for non-oxidizing drying processes in semiconductors, electronics, healthcare, instrumentation and other fields;
Product Features
- Intelligent touchscreen control allows direct setting of temperature, vacuum level, time and other parameters, with menu-driven operation for convenient use and maintenance;
- A 316 stainless-steel chamber provides improved resistance to acid and alkali corrosion, durability and easy cleaning;
- The rectangular vacuum chamber provides a large usable volume and efficient use of space;
- A resilient double-layer tempered-glass door provides a clear view of objects inside the chamber;
- Door-closing tightness is adjustable, and a one-piece molded synthetic silicone-rubber door seal ensures a high vacuum inside the chamber;
- An additional temperature-control port for overtemperature protection effectively prevents safety problems such as loss of temperature control (optional);
- A low-noise dedicated vacuum pump provides stable, reliable vacuum control (HMDS vacuum drying oven);
- Chamber heating is used, with no electronic components inside the chamber, preventing contamination and reducing susceptibility to corrosion for safer use;
- An ultra-high-vacuum pump ensures a chamber vacuum level of 1.0×10-4Pa (high-vacuum drying oven);
Programmable Control
- Programmable operation automatically controls heating, vacuum setpoint, nitrogen admission, time and other parameters according to process requirements, ensuring consistent baking between batches and reducing product-to-product baking variation;
- A 485 communication interface enables external software to view equipment and program operating status, keeping operation continuously monitored;
Technical Specifications
| Technical Specification / Model | HMDS Vacuum Drying Oven | High-vacuum Drying Oven | ||
|---|---|---|---|---|
| BPZ-6060MS | BPZ-6090MS | BPZ-6060HV | BPZ-6090HV | |
| Supply Voltage | AC220V 50HZ | AC220V 50HZ | ||
| Input Power | 3000W | 3500W | 3000W | 3500W |
| Temperature Control Range | RT+10~250°C | RT+10~200°C | ||
| Temperature Resolution / Fluctuation | 0.1°C /±1°C | 0.1°C /±1°C | ||
| Achievable Vacuum Level | 100Pa | 1.0×10-4Pa ultimate vacuum | ||
| Vacuum Display | Electronic vacuum display | Electronic vacuum display | ||
| Ambient Operating Temperature | +5~40°C | +5~40°C | ||
| Chamber Dimensions (mm) W×D×H | 400×400×400 | 450×450×450 | 400×400×400 | 450×450×450 |
| Overall Dimensions (mm) W×D×H | 600×570×1390 | 610×590×1350 | 600×570×1390 | 610×590×1350 |
| Shelves | 2 shelves | 2 shelves | ||
| Heating Method | Chamber heating | Chamber heating | ||
| Chamber Material | 316 stainless steel | 316 stainless steel | ||
※ Performance parameters are tested without a load at an ambient temperature of 20°C and ambient humidity of 50%RH.
Note: The housing can be customized in 304 stainless steel.
